Characterization of Solder Defects on Package on Packages with AXI Systems for Inspection Quality Improvement
Published: |
May 30, 2016 |
Author: |
Zhen Feng, Ph. D., David Geiger, Weifeng Liu, Ph. D., Anwar Mohammed, Murad Kurwa, AEG, Flextronics, George Tint Ph. D., Saki America. |
Abstract: |
As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls, we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. It is found that 3D measurements offer better defect inspection quality, lower false call and escapes.... |
|
Company Information:
More articles from Flex (Flextronics International) »
- Jan 23, 2019 - AOI Capabilities Study with 03015 Component
- Jun 15, 2017 - Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with Scanning Acoustic Tomography (SAT)
- Oct 27, 2016 - Press Fit Technology Roadmap and Control Parameters for a High Performance Process
- Sep 01, 2016 - Reliability Study of Low Silver Alloy Solder Pastes
- Aug 18, 2016 - Selective Reflow Rework Process
- See all SMT / PCB technical articles from Flex (Flextronics International) »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
Characterization of Solder Defects on Package on Packages with AXI Systems for Inspection Quality Improvement article has been viewed 527 times