Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections
Published: |
November 1, 2007 |
Author: |
Rabindra N. Das, Konstantinos I. Papathomas, John M. Lauffer and Frank D. Egitto |
Abstract: |
This paper discusses micro-filled epoxy-based conducting adhesives modified with nanoparticles, conducting polymers, and low melting point (LMP) fillers for z-axis interconnections, especially as they relate to package level fabrication, integration,... |
|
|
|
|
|
|
You must be a Company Information:
More articles from i3 Electronics »
- Aug 14, 2014 - Advanced Organic Substrate Technologies To Enable Extreme Electronics Miniaturization.
- May 05, 2011 - Manufacturing Substrates with Embedded Passives
- Dec 22, 2010 - Nanofluids, Nanogels and Nanopastes for Electronic Packaging
- Oct 28, 2010 - Organic Optical Waveguide Fabrication in a Manufacturing Environment
- Aug 05, 2010 - PWB Manufacturing Variability Effects on High Speed SerDes Links: Statistical Insights from Thousands of 4-Port SParameter Measurements
- See all SMT / PCB technical articles from i3 Electronics »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections article has been viewed 537 times
