Investigation and Development of Tin-Lead and Lead-Free Solder Pastes to Reduce the Head-In-Pillow Component Soldering Defect.
Published: |
March 6, 2014 |
Author: |
Jasbir Bath, Roberto Garcia - Christopher Associates Inc. Noriyoshi Uchida, Hajime Takahashi, Gordon Clark, Manabu Itoh - Koki Solder |
Abstract: |
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Christopher Associates Inc. »
- Jan 24, 2013 - An investigation into low temperature tin-bismuth and tin-bismuth-silver lead-free alloy solder pastes for electronics manufacturing applications
- See all SMT / PCB technical articles from Christopher Associates Inc. »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
Investigation and Development of Tin-Lead and Lead-Free Solder Pastes to Reduce the Head-In-Pillow Component Soldering Defect. article has been viewed 642 times