Assembly Process Development for Chip-Scale and Chip-Size μBGA™
Published: |
May 9, 1999 |
Author: |
Vern Solberg. |
Abstract: |
This paper will review chip-scale and chip-size package variations, solder alloy options, furnish guidelines for solder stencil development and outline the actual processes used to successfully produce SMT assemblies utilizing CSP technology. ... |
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